Snapdragon 460 Mobile Platform Firmware Security Vulnerabilities

CVE-2024-21469

Memory corruption when an invoke call and a TEE call are bound for the same trusted application.

CVE-2024-23368

Memory corruption when allocating and accessing an entry in an SMEM partition.

CVE-2024-23372

Memory corruption while invoking IOCTL call for GPU memory allocation and size param is greater than expected size.

CVE-2024-23373

Memory corruption when IOMMU unmap operation fails, the DMA and anon buffers are getting released.

CVE-2024-23380

Memory corruption while handling user packets during VBO bind operation.